Postdoctoral Fellow in Electrical and Electronic Engineering

University of Hong Kong Department of Electrical and Electronic Engineering

Hong Kong

Post-doctoral Fellow

The University of Hong Kong

Apply now Ref.: 511570
Work type: Full-time
Department: Department of Electrical and Electronic Engineering (14300)

Categories: Academic-related Staff
Hong Kong

Applications are invited for appointment as Post-doctoral Fellow (2 posts) in the Department of Electrical and Electronic Engineering (Ref.: 511570), to commence as soon as possible for one year.

Applicants should possess a Ph.D. degree with background in Physics/Applied Physics/ /Optical Engineering/Materials Science, and have demonstrated knowledge and experience in optical microscopy, optics, quantum sensing, nanofabrication, metasurfaces and related areas. Technical experience in applying advanced optical microscopy and atomic force microscopy will be highly desirable.  Applicants should be highly self-motivated and have excellent communication skills in written and spoken English as well as the ability to work independently. The appointees will work under the supervision of Dr. Zhiqin Chu.

The appointees will participate in a multidisciplinary research project which involve the practical applications of precision sensing and imaging platforms based on various diamond defects. Detailed enquiries about the duties of the post should be sent to Dr. Zhiqin Chu at

A highly competitive salary commensurate with qualifications and experience will be offered, in addition to annual leave and medical benefits.  At current rates, salaries tax does not exceed 15% of gross income.

The University only accepts online application for the above posts.  Applicants should apply online and upload an up-to-date C.V. Review of applications will start as soon as possible and continue until June 30, 2022, or until the post is filled, whichever is earlier.

Advertised:Jan 18, 2022 (HK Time)
Applications close:Jun 30, 2022 (HK Time)

Apply now

In your application, please refer to


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